In the precision manufacturing of semiconductors, Chemical Mechanical Polishing (CMP) is a core technology for the global planarization of wafer surfaces. CMP achieves nanometer-level flatness of wafer surfaces through the synergistic effect of chemical etching and mechanical polishing. As the core medium in this process, slurry performance directly determines the surface flatness of wafers and device yield.

Chemical components in slurry mainly include oxidizing agents (most commonly H₂O₂), nano-abrasives (SiO₂, Al₂O₃, CeO₂, etc.), complexing agents, corrosion inhibitors, pH adjusters, and others. With the continuous advancement of process nodes, the application frequency of the CMP process in overall manufacturing has increased significantly, accompanied by a sharp rise in chemical consumption and extremely high purity requirements.

Accordingly, the selection of packaging and delivery materials for chemicals is critical.

BSL (Baoshili) Ultra-Clean Solutions include high-end products such as Ultra-Clean PFA Tube, Ultra-Clean PFA Connector, Ultra-Clean HDPE Drum and Cleanroom Wiper, which effectively guarantee the purity of slurry. Except for the Cleanroom Wiper, the other three products share two key advantages: an extremely low metal ion precipitation rate and excellent chemical corrosion resistance, covering multiple links of chemical delivery, distribution, storage and transportation in the CMP process.

1. Delivery Process

In addition, slurry in the CMP process is usually acidic or alkaline, making metal impurities highly prone to chemical reactions that impair chemical performance. Through independently developed innovative processes, BSL controls the metal ion precipitation of its products to an extremely low level.

2. Distribution Process

In the CMP distribution system, slurry is transferred from storage tanks to polishing tools and distributed onto wafer surfaces. Dead spaces in chemical pipelines and connectors can easily cause nano-particles in slurry to deposit and form "dead zones", leading to particle agglomeration and eventually scratches on wafer surfaces during polishing.

With a smooth inner wall that prevents scaling and residue buildup, BSL Ultra-Clean PFA Connector achieves seamless docking and tight sealing with Ultra-Clean PFA Tube, constructing a complete, high-tightness slurry delivery system.

3. Storage Process

The core risk in slurry storage comes from residual metal catalysts in packaging materials. Oxidizing agents represented by H₂O₂ are highly oxidative. Trace amounts of transition metals (e.g., iron, copper, nickel) in HDPE drum walls can catalyze the decomposition of H₂O₂ into oxygen and water, causing container bulging or even rupture, as well as invalidation of slurry concentration.

BSL’s independently developed ultra-clean blow molding process realizes full-chain process control in production, ensuring the inner wall of the drum meets the G5 high-purity standard. For strong alkaline solutions commonly used in CMP, the Ultra-Clean HDPE Drum effectively inhibits the penetration of alkaline liquids into the polymer matrix, maintaining stable purity after long-term storage. The drum body will not swell, decompose or precipitate impurities during prolonged storage.

4. Maintenance Process

In cleanroom environments, routine cleaning and maintenance of CMP tools, pipeline systems and storage containers are essential. BSL Cleanroom Wiper delivers excellent cleaning performance with high wiping efficiency and no fiber shedding, meeting the wiping requirements for mechanical maintenance and environmental cleaning in cleanrooms.

In the CMP process, contamination at any stage — from slurry delivery pipelines and distribution connectors to storage drums and cleaning wipes — can directly impact wafer yield. Targeting the practical needs of the CMP process, BSL has built an ultra-clean solution covering the four core links of delivery, distribution, storage and cleaning maintenance. Meanwhile, as semiconductor process nodes continue to evolve, BSL will keep enhancing its independent R&D capabilities, develop more advanced consumable products for semiconductor manufacturing, and contribute to the development of the industry.